High-Performance Computing & T2DC

High-Performance Computing & the Tactically Deployable Data Center (T2DC™)​​

High-Performance Computing & the Tactically Deployable Data Center (T2DC™)​

Modular, Rackmount Systems for T2DC™

To combat data decay—or the sudden or incremental decline in value of a data set over time—systems-of-systems architects are driving high-performance computing (HPC), storage and networking resources to the edge. Uncontrolled and unpredictable edge environments introduce design challenges like shock and vibration; unstable power; size, weight and thermal constraints; extreme temperatures; mobility requirements and more.

Trilogic Systems and its consortium of more than 20 vetted embedded hardware OEMs design to standards such as IEC 60068-2-27/64, MIL-STD-810F/G, MIL-STD-461F, MIL-S-901D and others that support deployment in harsh conditions. With a US-based integration team and legacy of designing and deploying systems in rugged, harsh environments, we are a trusted partner who can implement your next-generation high-performance edge applications.

Download the data sheet and read more

Composable Infrastructure for Edge Environments

Architectures have been traditionally restricted to available rack space. Trilogic Systems enables solution scalability in targeted applications through composable disaggregated infrastructure (CDI), hyperconverged infrastructure (HCI) and distributed computing.

T2DC™: The Tactically Deployable Data Center

The Tactically Deployable Data Center, or T2DC™, empowers critical industry end users to deploy CDI, HCI and other modern data center technologies into the field. Built on top of modular industry standards like the Open Compute Project (OCP) and ruggedized to specifications like MIL-S-901D, Trilogic Systems’ T2DC™ enables rugged, scalable and interoperable rackmount computing infrastructure in far edge environments. The outcome is accelerated data insights and decision cycles for the most compute-intensive applications of today and tomorrow.

Tactically Deployable Data Center White Paper

Packaging for Rugged Edge Intelligence

Integrated, Tested & Validated Housings for HPC at the Edge

Migrating advanced technology solutions to the edge requires robust packaging capable of protecting sensitive electronics from dust, dirt, debris, liquid, power loss, shock and vibration and more.

Fully integrated and validated rackmounts, enclosures and consoles from Trilogic Systems and its technology consortium can be designed to the highest IEC and MIL-STD standards, ingress protection (IP) ratings and/or customized to meet the requirements of any application. Design and assembly through integration and testing to cabling and labeling are all available to get your equipment deployed where it needs to be.